JPS6332248B2 - - Google Patents
Info
- Publication number
- JPS6332248B2 JPS6332248B2 JP17255981A JP17255981A JPS6332248B2 JP S6332248 B2 JPS6332248 B2 JP S6332248B2 JP 17255981 A JP17255981 A JP 17255981A JP 17255981 A JP17255981 A JP 17255981A JP S6332248 B2 JPS6332248 B2 JP S6332248B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electrolytic capacitor
- terminal board
- plate
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000005007 epoxy-phenolic resin Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polybutylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17255981A JPS5873110A (ja) | 1981-10-27 | 1981-10-27 | チツプ形電解コンデンサおよびその製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17255981A JPS5873110A (ja) | 1981-10-27 | 1981-10-27 | チツプ形電解コンデンサおよびその製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5873110A JPS5873110A (ja) | 1983-05-02 |
JPS6332248B2 true JPS6332248B2 (en]) | 1988-06-29 |
Family
ID=15944094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17255981A Granted JPS5873110A (ja) | 1981-10-27 | 1981-10-27 | チツプ形電解コンデンサおよびその製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5873110A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2841339B2 (ja) * | 1988-08-11 | 1998-12-24 | 日本ケミコン 株式会社 | チップ形コンデンサ |
JPH0630329B2 (ja) * | 1988-06-29 | 1994-04-20 | 日本ケミコン株式会社 | チップ形コンデンサの製造方法 |
JP2832719B2 (ja) * | 1988-11-07 | 1998-12-09 | 日本ケミコン株式会社 | チップ形コンデンサ |
-
1981
- 1981-10-27 JP JP17255981A patent/JPS5873110A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5873110A (ja) | 1983-05-02 |
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